march 2007 rev 4 1/10 10 stps10l45c low drop power schottky rectifier main product characteristics features and benefits low forward voltage drop meaning very small conduction losses low dynamic losses as a result of the schottky barrier insulated package: to-220fpab insulating voltage = 2000 v dc capacitance = 12 pf avalanche capability specified description dual center tap schottky rectifiers suited for switched mode power supplies and high frequency dc to dc converters. packaged in to-220ab, to-220fpab, i 2 pak and d 2 pak, these devices are intended for use in low voltage, high frequency inverters, free-wheeling and polarity protection applications. i f(av) 2 x 5 a v rrm 45 v t j (max) 150 c v f (max) 0.46 v d 2 pa k stps10l45cg to-220ab stps10l45ct to-220fpab stps10l45cfp i 2 pa k STPS10L45CR a1 a2 k a1 k a2 a1 k a2 a1 k a2 a1 k a2 www.st.com
characteristics stps10l45c 2/10 1 characteristics when the diodes 1 and 2 are used simultaneously : tj(diode 1) = p(diode1) x r th(j-c) (per diode) + p(diode 2) x r th(c) to evaluate the conduction losses use the following equation: p = 0.33 x i f(av) + 0.026 i f 2 (rms) table 1. absolute ratings (limiting values, per diode) symbol parameter value unit v rrm repetitive peak reverse voltage 45 v i f(rms) rms forward voltage 20 a i f(av) average forward current to-220ab / d 2 pa k / i 2 pa k tc =135 c = 0.5 per diode per device 5 10 a to-220fpab t c = 140 c = 0.5 per diode per device 5 10 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 150 a i rrm repetitive peak reverse current t p = 2 s square f = 1 khz 1 a i rsm non repetitive peak reverse current t p = 100 s square 2 a p arm repetitive peak avalanche power t p = 1 s tj = 25c 2700 w t stg storage temperature range -65 to + 150 c t j maximum operating junction temperature (1) 1. condition to avoid thermal runaway for a diode on its own heatsink 150 c dv/dt critical rate of rise of reverse voltage 10000 v/s table 2. thermal resistances symbol parameter value unit r th(j-c) junction to case to-220ab / d 2 pak / i 2 pa k per diode to t a l 3 1.7 c/w r th (c) coupling 0.35 r th(j-c) junction to case to-220fpab per diode to t a l 5 3.8 c/w r th (c ) coupling 2.5 table 3. static electrical characteristics (per diode) symbol parameter test conditions min. typ. max. unit i r (1) 1. pulse test: tp = 380 s, < 2% reverse leakage current t j = 25 c v r = v rrm 0.15 ma t j = 100 c 45 90 ma v f (1) forward voltage drop t j = 25 c i f = 5 a 0.53 v t j = 125 c i f = 5 a 0.36 0.46 t j = 25 c i f = 10 a 0.67 t j = 125 c i f = 10 a 0.49 0.59 d ptot dtj - -------------- 1 rth j a ? () ------------------------- - <
stps10l45c characteristics 3/10 figure 1. average forward power dissipation versus average forward current (per diode) figure 2. average forward current versus ambient temperature ( = 0.5, per diode) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 p (w) f(av) t =tp/t tp i (a) f(av) = 0.05 = 0.1 = 0.2 = 0.5 = 1 0 25 50 75 100 125 150 0 1 2 3 4 5 6 i (a) f(av) to-220fpab to-220ab / d pak / i 22 pa k r=r th(j-a) th(j-c) t (c) amb t =tp/t tp r =15c/w th(j-a) figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t) p (1s) arm p arm 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t) p (25c) arm p arm figure 5. non repetitive surge peak forward current versus overload duration (maximum values, per diode) (to-220ab, i 2 pak and d 2 pak) figure 6. non repetitive surge peak forward current versus overload duration (maximum values, per diode) ( to-220fpab) 1e-3 1e-2 1e-1 1e+0 0 10 20 30 40 50 60 70 80 90 100 i (a) m i m t =0.5 t(s) t =25c c t =75c c t =125c c 1e-3 1e-2 1e-1 1e+0 0 10 20 30 40 50 60 70 80 i (a) m i m t =0.5 t(s) t =25c c t =75c c t =125c c
characteristics stps10l45c 4/10 figure 7. relative variation of thermal impedance junction to case versus pulse duration (to-220ab, i 2 pak and d 2 pak) figure 8. relative variation of thermal impedance junction to case versus pulse duration (to-220fpab) 1e-3 1e-2 1e-1 1e+0 0.0 0.2 0.4 0.6 0.8 1.0 z/r th(j-c) th(j-c) t =tp/t tp t (s) p = 0.5 = 0.2 = 0.1 single pulse 1e-3 1e-2 1e-1 1e+0 1e+1 0.0 0.2 0.4 0.6 0.8 1.0 z/r th(j-c) th(j-c) t =tp/t tp t (s) p = 0.5 = 0.2 = 0.1 single pulse figure 9. reverse leakage current versus reverse voltage applied (typical values, per diode) figure 10. junction capacitance versus reverse voltage applied (typical values, per diode) figure 11. forward voltage drop versus forward current (maximum values, per diode) figure 12. thermal resistance junction to ambient versus copper surface under tab (epoxy printed circuit board fr4, copper thickness: 35 m) ( d 2 pak) 0 5 10 15 20 25 30 35 40 45 1e-3 1e-2 1e-1 1e+0 1e+1 1e+2 i (ma) r v (v) r t =125c j t =150c j t =100c j t =25c j 12 51020 50 10 100 1000 c(pf) v (v) r f=1mhz v =30mv t =25c osc rms j 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0.1 1.0 10.0 100.0 i (a) fm v (v) fm t =25c j t =125c j t =150c (typical values) j 0 4 8 12 16 20 24 28 32 36 40 0 10 20 30 40 50 60 70 80 r (c/w) th(j-a) s(cu)(cm2)
stps10l45c package information 5/10 2 package information epoxy meets ul94, v0 cooling method: by conduction (c) recommended torque value: 0.55 nm maximum torque value: 0.70 nm table 4. to-220ab dimensions ref dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 f2 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 g1 2.40 2.70 0.094 0.106 h2 10 10.40 0.393 0.409 l2 16.4 typ. 0.645 typ. l4 13 14 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. diam. 3.75 3.85 0.147 0.151 a c d l7 dia l5 l6 l9 l4 f h2 g g1 l2 f2 f1 e m
package information stps10l45c 6/10 table 5. i 2 pak dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.044 0.067 c 0.49 0.70 0.019 0.028 c2 1.23 1.32 0.048 0.052 d 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 e 10 10.40 0.394 0.409 l 13 14 0.512 0.551 l1 3.50 3.93 0.138 0.155 l2 1.27 1.40 0.050 0.055 e l2 l1 b1 d a1 c c2 a b e e1 l
stps10l45c package information 7/10 table 6. to-220fpab dimensions ref dimensions millimeters inches min. max. min. max. a 4.4 4.6 0.173 0.181 b 2.5 2.7 0.098 0.106 d 2.5 2.75 0.098 0.108 e 0.45 0.70 0.018 0.027 f 0.75 1 0.030 0.039 f1 1.15 1.70 0.045 0.067 f2 1.15 1.70 0.045 0.067 g 4.95 5.20 0.195 0.205 g1 2.4 2.7 0.094 0.106 h 10 10.4 0.393 0.409 l2 16 typ. 0.63 typ. l3 28.6 30.6 1.126 1.205 l4 9.8 10.6 0.386 0.417 l5 2.9 3.6 0.114 0.142 l6 15.9 16.4 0.626 0.646 l7 9.00 9.30 0.354 0.366 dia. 3.00 3.20 0.118 0.126 h a b dia l7 l6 l5 f1 f2 f d e l4 g1 g l2 l3
package information stps10l45c 8/10 figure 13. footprint (dimensions in millimeters) in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com. table 7. d 2 pak dimensions ref dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8 g l l3 l2 b b2 e * flat zone no less than 2m m a c2 d r a2 m v2 c a1 * 16.90 10.30 8.90 3.70 5.08 1.30
stps10l45c ordering information 9/10 3 ordering information 4 revision history ordering type marking package weight base qty delivery mode stps10l45ct stps10l45ct to-220ab 2.23 g 50 tube stps10l45cfp stps10l45cfp to-200fpab 2 g 50 tube stps10l45cg stps10l45cg d 2 pak 1.48 g 50 tube stps10l45cg-tr stps10l45cg d 2 pak 1.48 g 1000 tape and reel STPS10L45CR st ps10l45cr i 2 pak 1.49 g 50 tube date revision description of changes jul-2003 3b last release. 22-mar-2007 4 removed isowatt package. added i 2 pak package.
stps10l45c 10/10 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2007 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
|
